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以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。，推荐阅读51吃瓜获取更多信息
Владислав Уткин。同城约会是该领域的重要参考
"I used to be a seafarer, and I didn't want to carry on on ships, but to do something similar. I thought this would align pretty well with the skills that I've got."